Technelec Ltd
Oakham
I completed a six-month industrial placement at Technelec, working as an Engineering Intern within the power electronics team. Throughout the placement, I supported the design and development of inverter systems used for electric motor applications, contributing to projects involving electrical simulation, thermal modelling, PCB design and control system development. My role evolved from supporting engineering investigations to undertaking increasingly independent technical projects. A major focus of my work was developing simulation-based tools to evaluate power semiconductor devices before hardware implementation, helping engineers make informed design decisions. I also contributed to PCB design reviews and independently developed control strategies for a three-phase four-leg inverter capable of operating under balanced, unbalanced and nonlinear loading conditions. The placement provided valuable experience of applying university knowledge to real engineering challenges while working closely with experienced engineers. It strengthened both my technical understanding and my confidence in solving practical engineering problems within an industrial environment.
As an Engineering Intern, I supported the design and analysis of power electronic systems through simulation, modelling and engineering investigations. My responsibilities included developing LTspice electrical simulation models, creating thermal models to predict component temperatures, evaluating candidate MOSFETs, supporting PCB design reviews and investigating design improvements. During the latter stages of the placement, I independently developed and evaluated control strategies for a three-phase four-leg inverter, researching different control approaches through technical literature before implementing and validating them in simulation. I also extended simulation models to investigate practical design aspects such as snubber circuits and thermal performance. Several of the simulation tools developed during my placement have since been adopted internally to support future component evaluation and engineering design decisions, allowing electrical and thermal performance to be assessed before hardware implementation.
Throughout the placement, I developed practical experience in power electronics design, electrical simulation and thermal modelling. I extensively used LTspice to model inverter circuits, evaluate semiconductor switching behaviour and investigate practical design considerations such as snubber circuits and parasitic effects. I also developed parameterised thermal RC models to predict junction temperatures using electrical power losses obtained from simulation. In addition, I gained experience using Altium Designer to review PCB layouts and understand the influence of component placement, routing and PCB construction on electrical and thermal performance. The placement also strengthened my understanding of inverter control systems through the implementation and evaluation of multiple control strategies for a three-phase four-leg inverter.
The placement significantly improved my professional skills alongside my technical development. Working within a multidisciplinary engineering team strengthened my communication skills through regular design discussions, technical presentations and the explanation of simulation results. I also developed greater confidence in independently researching unfamiliar topics, planning technical investigations and justifying engineering decisions using evidence from simulation and analysis. Regular collaboration with experienced engineers highlighted the importance of teamwork, constructive feedback and considering alternative viewpoints when solving engineering problems. As my placement progressed, I became increasingly confident managing my own workload, taking ownership of technical projects and adapting to new challenges within a professional engineering environment.