Technelec Ltd.
Technelec Ltd. Lands End Way, Oakham, Rutland, LE15 6RB, United Kingdom
During my industrial placement at Technelec Ltd, I participated in the development of motor-drive inverter hardware for applications including robotics, marine systems and unmanned aerial vehicles. The placement gave me experience of the complete development cycle of an inverter PCB, from component selection and circuit modelling through schematic capture, PCB layout, manufacturing and laboratory validation. I first used datasheets and LTspice simulations to evaluate electrical behaviour, component ratings and thermal performance. I then supported schematic development and produced PCB layouts in Altium Designer, considering electrical performance, thermal management, manufacturability and physical constraints. Once the board was manufactured, I took part in bring-up and testing, verifying the DC conversion, buck and fly-buck supplies, CAN and MCU communication, and inverter switching waveforms. The final stage involved investigating switching-voltage overshoot and ringing. I applied an analytical RC snubber design method and performed controlled oscilloscope tests under different operating conditions. Overall, the placement connected academic theory with a complete industrial hardware-development process and strengthened my interest in power electronics and hardware engineering.
My role was to support the design and validation of an inverter PCB while gradually taking greater ownership of individual engineering tasks. I researched and selected components using datasheets, checking electrical ratings, thermal performance, package availability, cost and manufacturability. I developed and reviewed LTspice electrical and thermal models, updated schematics, created and checked footprints, and completed PCB layout work in Altium Designer. During layout, I considered high-current paths, grounding, sensitive signal routing, thermal dissipation, connector placement and mechanical constraints. I revised the design following regular reviews with senior engineers and documented design decisions and test results. After manufacture, I contributed to board bring-up by checking power rails, communication interfaces and switching behaviour. When the basic functional tests were successful, I independently identified the remaining voltage transient as an area requiring further investigation. I planned an RC snubber study, selected component combinations, established consistent measurement criteria and compared their effects on overshoot and ringing. When results differed from theoretical expectations, I considered parasitic elements, operating current and measurement consistency rather than relying on a single measurement. This enabled me to contribute an evidence-based assessment of the design trade-offs.
I developed practical skills across power electronics design, PCB development and laboratory validation. I improved my ability to interpret component datasheets and select MOSFETs, gate drivers, converters, protection devices, sensing circuits and communication components according to electrical, thermal and manufacturing requirements. Using LTspice, I performed circuit simulation and thermal modelling to assess operating conditions and challenge design assumptions. In Altium Designer, I strengthened my schematic-capture and multilayer PCB-layout skills, including footprint creation, design-rule checking, grounding, high-current routing, differential signals, thermal management and design for manufacture. I also gained experience in inverter bring-up and debugging using oscilloscopes, power supplies and communication interfaces. This included validating DC power rails, CAN and MCU communication, gate signals and switching waveforms. I also improved my technical documentation, structured testing and engineering judgement.
During the placement, I developed stronger communication, teamwork and project-management skills. Regular design reviews taught me to explain technical decisions clearly, respond constructively to feedback and revise my work based on the experience of senior engineers. I also learned to communicate progress and unexpected test results honestly rather than presenting conclusions before sufficient evidence was available. Working across simulation, schematic design, PCB layout and testing required me to prioritise tasks, manage deadlines and maintain clear documentation so that others could review or continue my work. Collaboration with engineers from different areas improved my understanding of how individual design decisions affect manufacturing, testing and the wider project. The placement also strengthened my independence and problem-solving approach. When results differed from expectations, I learned to investigate possible causes systematically, ask focused questions and propose practical next steps. Overall, I became more confident in taking ownership of engineering tasks while recognising when consultation and peer review were necessary.